Semiconductor Consumables
CONSUMABLES FOR ETCH, Epi, CVD AND PVD PROCESSES
The requirements of the semiconductor industry on the quality of spare parts for the corresponding production facilities are increasing continuously. The different processes and areas of application of these spare parts require special materials and a high grade of precision and purity. Specially in plasma etching but also in coating processes (CVD, PVD) and in wet etching processes, these components are exposed to an aggressive and corrosive environment. Even is these operating conditions, the components shouldn‘t generate any contamination or particles and their lifetime in the process has to be sufficient in order to keep expenses for maintenance and spare parts requirements within economical limits. We have the process-specific know-how for selecting the right material and supply the corresponding components.
O-RINGS
O-rings are specially processed for use in High Vacuum and Ultra High Vacuum equipment. All of our O-rings are cleaned and packaged in a certified Class 100/ISO Class 5 Cleanroom, making them suitable for immediate use in HV, UHV, or EUV applications.
- Fluorocarbon (FKM)
- Nitrile rubber (NBR)
- Hydro Nitrile (HNBR)
- Fluorosilicone (FVMQ)
- Silicone Rubber (VMQ)
- Polyacrylate (ACM)
- Perfluoroelastomer (FFKM)
- Epichlorohydrin (CO, ECO)
- Butyl Rubber (IIR)
- Chloroprene Rubber (CR)
- (EPM,EPDM)
high-performance spring energized PTFE seals
Spring-energized PTFE seals are typically used in areas where elastomeric seals cannot meet the frictional, temperature, pressure, or chemical-resistance requirements of the application.
Rubber bellow
Rubber bellows (also known as expansion joints) are used to protect moving mechanical parts from dust and humidity. The concertinaed sides allow the rubber bellow to expand and contract whilst maintaining a permanent seal.
Rubber Gaskets & Seals
Industrial gaskets are fundamental components that aid in minimizing vibration, preventing leaks, and improving the mounting process by sealing joints.
SAPPHIRE & QUARTZ
GATE DOOR - Slit Valve Door
Slit Valve Doors (SVDs) are a core component of various semiconductor process tools. They create a barrier between hostile process environments and the milder areas of the equipment. Demands for ultra-purity and plasma resistance have resulted in the development of specific compounds for the Semiconductor industry. These materials offer supreme performance in sealing those applications. We offer a range of materials and profiles that maximize the sealing integrity and life expectancy for bonded and non-bonded slit valve doors and MONOVAT® gates.
CUSTOMIZED Silicon Carbide (SiC) parts
Silicon carbide (SiC) is a hard and thermally stable ceramic material that has a wide range of applications in the semiconductor industry. SiC parts are used as components in a variety of processing tools and equipment, such as furnace liners, susceptors, boats, and heat exchangers. The high thermal stability and thermal conductivity of SiC make it a popular choice for applications that require high temperature processing, and its high hardness and strength make it ideal for use in high-wear applications. SiC parts can be fabricated into complex shapes, making them well-suited for use in demanding processing environments where high-precision components are required.
Customized Boron Nitride (BN) Ceramic Parts
Boron Nitride is an advanced synthetic ceramic material available in solid and powder form. Its unique properties – from high heat capacity and outstanding thermal conductivity to easy machinability, lubricity, low dielectric constant, and superior dielectric strength – make boron nitride a truly outstanding material.
In its solid form, boron nitride is often referred to as “white graphite” because it has a microstructure similar to that of graphite. However, unlike graphite, boron nitride is an excellent electrical insulator that has a higher oxidation temperature. It offers high thermal conductivity and good thermal shock resistance and can be easily machined to close tolerances in virtually any shape. After machining, it is ready for use without additional heat treating or firing operations.
lift pins
Lift pins are used in assemblies to lift and move wafers through semiconductor processing positions. Since they are exposed to chamber or other processing conditions, they require robust thermal stability and corrosion resistance.